JPH01133766U - - Google Patents
Info
- Publication number
- JPH01133766U JPH01133766U JP3066888U JP3066888U JPH01133766U JP H01133766 U JPH01133766 U JP H01133766U JP 3066888 U JP3066888 U JP 3066888U JP 3066888 U JP3066888 U JP 3066888U JP H01133766 U JPH01133766 U JP H01133766U
- Authority
- JP
- Japan
- Prior art keywords
- packaged
- resin part
- resin
- mounting
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3066888U JPH01133766U (en]) | 1988-03-08 | 1988-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3066888U JPH01133766U (en]) | 1988-03-08 | 1988-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133766U true JPH01133766U (en]) | 1989-09-12 |
Family
ID=31255930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3066888U Pending JPH01133766U (en]) | 1988-03-08 | 1988-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133766U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024232040A1 (ja) * | 2023-05-10 | 2024-11-14 | 日立Astemo株式会社 | 電子制御装置及び同製造方法 |
-
1988
- 1988-03-08 JP JP3066888U patent/JPH01133766U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024232040A1 (ja) * | 2023-05-10 | 2024-11-14 | 日立Astemo株式会社 | 電子制御装置及び同製造方法 |